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Jun 02, 2026
Products & Solutions / Press Releases
Achieves both high-precision mounting and mass-production capability, contributing to the expansion of the medium-sized OLED market
Tokyo, Japan – The Panasonic Connect Group (https://connect.panasonic.com/en/) (Group CEO: Ken Sain) announced that it will launch the new FPX107CG/FP driver mounting system for manufacturing processes of medium-sized organic light-emitting diode (OLED) panels in June 2026.
In the display market, liquid crystal displays (LCDs) have traditionally been the primary technology adopted in medium-sized applications such as IT devices — including notebook PCs and tablets — as well as automotive applications. However, in recent years the adoption of OLED panels has been gradually increasing, driven by the need for higher image quality and thinner, lighter designs. This trend is expected to continue expanding.
Along with this shift, panel manufacturers are accelerating capital investment in equipment for medium-sized OLED panel production. In the driver mounting process for OLED panels, materials with higher coefficients of thermal expansion than those used in LCDs are employed, making it more challenging to achieve precise mounting accuracy. At the same time, there is growing demand for even higher mounting precision as well as the ability to support diverse mounting configurations, including multi-product and multi-mount production.
In response to these market trends and evolving needs, the Panasonic Connect Group has developed the FPX107CG/FP mounting system for medium-sized OLED panels. This product further enhances the company’s core strength in high-precision mounting technology and adopts an equipment configuration that enables optimal mass-production line proposals tailored to each customer’s production requirements. Through this solution, the company supports both high quality and high productivity in the manufacturing of medium-sized OLED panels.
Existing Model (FPX105CG):
Target panel: LCDs
Main bonding accuracy (IC/TCP): ±5 μm (3σ)
New Model (FPX107CG/FP):
Target panel: OLEDs
Main bonding accuracy (IC/TCP): ±3 μm (3σ), Cpk 1.33
Existing Model:
All-in-one configuration integrating the driver mounting process (ACF lamination, temporary bonding, and final bonding) within a single unit.
New Model:
Modular configuration in which each process step (ACF lamination, temporary bonding, and final bonding) is separated, enabling flexible system design tailored to different mounting configurations.
The Panasonic Connect Group is committed to providing equipment and solutions that are closely aligned with manufacturing site operations. Through the provision of this product, the company will support the advancement and efficiency of medium-sized OLED panel manufacturing and contribute to the continued development of the display industry.
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About Panasonic Connect Group The Panasonic Connect Group (https://connect.panasonic.com/en/) plays a central role in the growth of the overall Panasonic Group’s (https://holdings.panasonic/global/) B2B solutions business and provides new value to its customers by working with them on the ground, facing their challenges alongside them. With roughly 29,100 employees worldwide and annual sales of JPY1,380 billion, we provide new value to our customers by combining advanced hardware, intelligent software solutions, and a wealth of knowledge in industrial engineering accumulated in our over 100-year history. The company’s purpose is to “Change Work, Advance Society, Connect to Tomorrow.” By driving innovation in the supply chain, public services, infrastructure, and entertainment sectors, the Panasonic Connect Group aims to contribute to the realization of a sustainable society and to ensure well-being for all. |
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