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Dec 13, 2018
Products & Solutions / Press Release
The move responds to strong semiconductor demand in China and Taiwan
Osaka, Japan - Panasonic Corporation announced today that it will enhance its production and development functions for the substrate material MEGTRON GX, which is used in semiconductor packages and modules, in China and the North East Asian region.
With the recent trend of IoT (Internet of Things) and smartphones with greater functionality, the semiconductor package and module market is significantly expanding and the demand for substrate materials is also rapidly increasing. China, in particular, has been promoting the domestic manufacturing of semiconductors with stronger demand for substrate materials expected in the future. In addition, Taiwan's position as a key development and manufacturing site for semiconductors as well as packages and modules is gaining momentum. In such an environment, Panasonic will enhance its substrate material business in China and Taiwan to meet the increasing demand for the required materials.
In addition to the current production sites, the Koriyama operation (Koriyama, Fukushima, Japan) and Panasonic Industrial Devices Materials Taiwan Co., Ltd. who manufacture substrate materials for semiconductor packages and modules, Panasonic Industrial Devices Materials (Suzhou) Co. Ltd., which currently produces and sells multi-layer circuit board materials, will launch the production and sales of substrate materials for semiconductor packages and modules in April 2019. The objective of this operation is to respond to the increased demand for rapid deliveries and services by semiconductor manufacturers, semiconductor packaging manufactures, and substrate manufacturers particularly in the Eastern China region.
In April 2019, the Taiwan Semiconductor Materials R&D Center will be established as part of Panasonic Industrial Devices Materials Taiwan, Co., Ltd., the current production site of multi-layer circuit board materials including substrate materials for semiconductor. This will enhance not only the rapid new product development but also the measurement and engineering service function to semiconductor manufacturers, semiconductor packaging manufacturers, and substrate manufacturers, thereby contributing to the reduction of customer's development lead-time.
|Company Name||Panasonic Industrial Devices Materials (Suzhou) Co., Ltd.|
|Location||1 Huai Hai Street, Suzhou New District, China (Suzhou, China)|
|Primary production items||•Multi-layer circuit board materials, glass-composite board materials, electronic circuit boards|
• Substrate materials for semiconductor packages/modules (Production to start in April 2019)
|Company Name||Panasonic Industrial Devices Materials Taiwan Co., Ltd.|
|Location||No.20-1, Kuang Fu Road, Hsin Chu Industrial District Hu Kou Hsiang,|
Hsin Chu Hsien Taiwan (Hsinchu,Taiwan)
|Primary production items||•Multi-layer circuit board materials, substrate materials for semiconductor packages and modules|
• Establishment of Taiwan Semiconductor Materials R&D Center (April 2019)
Panasonic Corporation is a worldwide leader in the development of diverse electronics technologies and solutions for customers in the consumer electronics, housing, automotive, and B2B businesses. Celebrating its 100th anniversary in 2018, the company has expanded globally and now operates 495 subsidiaries and 91 associated companies worldwide, recording consolidated net sales of 7.343 trillion yen for the year ended March 31, 2017. Committed to pursuing new value through innovation across divisional lines, the company uses its technologies to create a better life and a better world for its customers. To learn more about Panasonic: https://www.panasonic.com/global.
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