Panasonic Launches Delamination-free Semiconductor Encapsulation Material CV8213 Designed to Improve the Reliability and Extend the Operating Life of Semiconductor Packages

1. The delamination-free capability for suppressing separation between the lead frame and the semiconductor encapsulation material imparts semiconductor packages with increased heat resistance and longer operational life.

   - Temperature cycle test (TC test): No separation observed after 1000 cycles ( -65˚C to +175˚C)

2. Improved adhesion of the semiconductor encapsulation material to the lead frame. The reduced stress at the lead frame and encapsulation bond line enables the level of reliability required for automobile electronic components.

   - Achieved reliability standards of automobile electronic components AEC-Q100, Q101/Grade 0

3. This material also complies with automobile clip-bond packages (*5) requirements, contributing to the improved reliability of these semiconductor packages.

1. The capability to suppress separation between the lead frame and semiconductor encapsulation material provides semiconductor packages using this product increased temperature resistance and longer operational life.

   Previous semiconductor encapsulation materials experienced a considerable difference in linear coefficient of expansion between the lead frame and semiconductor encapsulation material. In high-temperature environments, this mismatch caused separation (delamination) between the lead frame and semiconductor encapsulation material in the temperature cycling (1000 cycles between -65˚C and +175˚C) required for automotive applications. This issue often required an additional lead frame roughening process to improve adhesion of the semiconductor encapsulation material. The product CV8213, however, has a much lower coefficient of thermal expansion than previous materials thus reducing the stress between the lead frame and the encapsulant. This product was formulated using Panasonic's unique resin design capabilities and reaction control technology, which suppresses delamination even in high-temperature environments like reflow assembly processes and temperature cycle testing, imparting semiconductor packages with increased temperature durability and a longer operating life.

2. The improved adhesion between the semiconductor encapsulation material and lead frame and the reduced stress experienced by the resin enable the package level reliability required for automotive components.

   This product improves the adhesion between lead frame and semiconductor encapsulation material and reduces the elasticity of the semiconductor encapsulation material by using Panasonic's unique resin design technology to relieve thermally induced stresses, particularly in high-temperature environments. This feature enables semiconductor packages to meet the challenging AEC-Q100, Q101/Grade 0 reliability standard for electronic components in automotive equipment and insures the reliability of semiconductor packages required for automotive applications.

3. This product also meets the specifications for automotive clip-bond type packages, (*5) thereby contributing to improved semiconductor package reliability.

   Because automotive semiconductor packages are used in elevated temperature environments and carry high currents, the connection process is changing over from conventional wire-bonding to clip-bond connections. A clip-bond package has a large contact area between the semiconductor encapsulation material and the lead frame metal clip. This package design requires strong adhesion between the encapsulation material and clip area of the lead frame. This semiconductor encapsulation material product exhibits both increased temperature resistance and the excellent adhesion strength required for clip-bond packages to be adopted in future automotive applications, thus contributing to enhanced semiconductor package reliability.

[Product name] CV8213 series Delamination-free Semiconductor Encapsulation Material

• Glass transition temperature: 125˚C
• CTE (ɑ1/ɑ2): 10/46 ppm/˚C
• Bending elasticity (260˚C): 0.4 GPa
• Moisture absorption rate: 0.13%
• pH: 7.0
• Temperature cycle test: Passes 1000 cycles ( -65˚C to +175˚C)

• Product inquiries

Disclaimer:

We would like to note that Panasonic Newsroom is not a place to address personal Customer Service issues. Even though this is not the forum, Panasonic is always eager to resolve your concerns. Our local customer services contacts can be found at Global Support or you can see our list of Social Media Accounts to find the right channel for your queries and concerns.

Related Links

• Detailed information for delamination-free semiconductor encapsulation material CV8213 series
• Panasonic Electronic Materials
• Automotive & Industrial Systems Company

Related News

• [Press Release] Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment (Jan 21, 2019)
• [Press Release] Panasonic to Bolster Substrate Material Business for Semiconductor Packages and Modules in China and North East Asian Region (Dec 13, 2018)
• Panasonic Commercializes Control Unit ELC500, Which Contributes to the Optimization of Energy Use in Plants by Enabling Monitoring/Control of Power Demand and Visualization of Production Information (Oct 03, 2018)
• Panasonic Commercializes ZS Series Conductive Polymer Hybrid Aluminum Electrolytic Capacitors, Which Is Optimal for Hybrid Electric Vehicles (HVs) and Electric Vehicles (EVs); Mass Production to Start in September 2018 (Sep 21, 2018)

Photos