【UPDATE】
January 23, 2024
The URL of inquiries regarding PID’s products has been updated.
【Correction】
February 16, 2024
One of Part Number in Appendix (1) Instances of incorrect authentication registration practices has been corrected:
Product type: Molding material, Production Location: Yokkaichi (Japan) and Part number: the fifth from the top
from: ME (x3) E, MP (x4) E Series
to: MP (x3) E, MP (x4) E Series
One of Part Number in Appendix (3) Irregularities in periodic audits has been corrected:
Product type: Molding material, Production Location: Yokkaichi (Japan)
from: CY8611 30GN
to: CY861130GN
Jan 12, 2024
Products & Solutions / Press Release
Irregularities in third-party certification of electronic materials and establishment of the external investigation committee
Osaka, Japan – Following an internal investigation, Panasonic Industry Co., Ltd. (“PID”) has identified instances of irregularities in the process of the third-party certification by UL Solutions (“UL”) for 52 part numbers of molding materials, semiconductor encapsulation materials and electronic circuit board laminate products manufactured and sold by PID’s Electronic Materials Business Division. In response to these irregularities, PID is providing this notification of the current situation and its planned actions.
1. Overview of irregularities: (Please refer to the appendix for details by part number)
(1) Instances of incorrect registration practices
The following products were manufactured and sold using different constituents from the certified product constituents without changing the registered part number:
- Molding materials, Yokkaichi plant (from the 1980s to present): 17 part numbers*
* 11 of these part numbers did not meet a certain threshold for their flammability ratings
- Semiconductor encapsulation materials, South Yokkaichi plant (from the 1980s to present): 19 part numbers*
* 19 part numbers did not meet a certain threshold for their flammability ratings
- Circuit board materials, Ayutthaya plant (from 2003 to present): 2 part numbers.*
* 1 of these part numbers did not meet a certain threshold for tracking its resistance
- Circuit board material, South Yokkaichi plant (from 2011 to 2021): 1 part number
(2) Instances of data alternation
(a) Some data for circuit board materials were altered for Relative Thermal Index (“RTI”) testing when applying for new product registration. After registration by UL, the products were manufactured and sold at the following locations:
- Koriyama plant (2010 to present): 8 part numbers
- Guangzhou plant (2016 to present): 5 part numbers
- Suzhou plant (2012 to present): 3 part numbers
- Taiwan plant (2011 to present): 3 part numbers
(b) Some data for circuit board materials’ flammability ratings were altered when applying for new product registration. After registration by UL, the products were manufactured and sold at the following locations:
- Koriyama plant (2014 to present): 1 part number
- Guangzhou plant (2016 to present): 2 part numbers
- Suzhou plant (2012 to present): 1 part number
- Taiwan plant (2011 to present): 1 part number
(3) Irregularities in periodic audits
PID has identified that some test samples were prepared using different constituents from those that were registered with UL and were submitted during periodic audits at the following locations:
- Molding material, Yokkaichi plant (2014 to present): 1 part number
- Circuit board materials, Ayutthaya plant (until 2021): 2 part numbers
2. PID’s response plan:
(1) PID will communicate directly with customers who have purchased the identified products and discuss future actions. Please submit any inquiries regarding PID’s products at the following websites:
(2) PID has not received reports of issues associated with the reported irregularities identified with the abovementioned products. PID will continue to investigate and keep its customers updated.
(3) PID has reported the above-identified issues to UL and is actively engaged with them regarding next steps.
(4) PID has established an external investigation committee comprised of external experts to (a) conduct thorough investigations, (b) analyze the root causes, and (c) propose measures to prevent re-occurrence.
Term Descriptions
- Molding materials:
JIS (Japan industrial standard) defines a molding material as "a material made mainly of polymeric substances that is formed into a usable shape." This generally refers to a plastic (resin) material molded into an intended shape. Molding materials are used in products such as automotive components and home appliances. - Semiconductor encapsulation materials:
Semiconductor encapsulation material is a polymer-based composite used to protect semiconductor chips from the environment. - Circuit board materials:
Circuit board material is a polymer composite sheet with or without copper foil on one or both sides. Circuit structures are formed on the copper and then the layers are laminated together with heat and pressure to form functional circuit boards. - Flammability:
Flammability is expressed in an assigned grade representing the degree of a plastic material's resistance to fire. - Tracking resistance:
Tracking refers to electrical breakdown on the surface of an electrical insulating material, as the result of low resistance paths (“tracks”), typically as a result of moisture or contamination. Tracking resistance is an indicator of a circuit board material's capability to resist tracking. - Relative thermal index (RTI):
The Relative Thermal Index (RTI) is a value related to the ability of circuit board materials to resist thermal degradation. RTI refers to the temperature at which the initial physical property value of a plastic reduces to half, after the plastic is exposed to air at a given temperature for 60,000 hours.
Appendix
(1) Instances of incorrect authentication registration practices
|
Product type |
Production Location |
Irregularity Time Period |
Part No. Count |
Part Number |
Characteristic |
Status |
Part No. Count |
|---|---|---|---|---|---|---|---|
|
Molding material |
Yokkaichi (Japan) |
1980s to present |
17 |
CE5100 Series |
Flammability |
Underachievement |
11 |
|
CE5410 Series |
Underachievement |
||||||
|
MBF (x3) Series |
Underachievement |
||||||
|
MBF (x3) G Series |
- |
||||||
|
MP (x3) E, MP (x4) E Series |
- |
||||||
|
MP (x3) A, MP (x4) A Series |
Underachievement |
||||||
|
CY2410 Series |
Underachievement |
||||||
|
CY3319 Series |
- |
||||||
|
CY47 (x) 1 Series |
Underachievement |
||||||
|
CY4815 Series |
Underachievement |
||||||
|
CY94 (x) 0 Series |
- |
||||||
|
CY8611, CY9613 series |
- |
||||||
|
MBS2 (a2) V+ Series |
Underachievement |
||||||
|
MBT1 (a3) V+, MBT1 (a3)-+ series |
Underachievement |
||||||
|
MBT120-+, MBT120 V+ Series |
Underachievement |
||||||
|
CE2925 Series |
Underachievement |
||||||
|
CU (x4) Series |
- |
||||||
|
Shanghai (China) |
Under investigation |
||||||
|
Ayutthaya (Thailand) |
Under investigation |
||||||
|
Encapsulation material |
South Yokkaichi (Japan) |
1980s to present |
19 |
CV5765 Series |
Flammability |
Underachievement |
19 |
|
CV5960 Series |
Underachievement |
||||||
|
CV4185, CV4185A Series |
Underachievement |
||||||
|
CV8710K Series |
Underachievement |
||||||
|
CV3400@ Series |
Underachievement |
||||||
|
CV3400H, CV3400VN Series |
Underachievement |
||||||
|
CV3600 Series |
Underachievement |
||||||
|
CV4160 Series |
Underachievement |
||||||
|
CV4180 Series |
Underachievement |
||||||
|
CV4400@ Series |
Underachievement |
||||||
|
CV8400 Series |
Underachievement |
||||||
|
CV8410 Series |
Underachievement |
||||||
|
CV8560 Series |
Underachievement |
||||||
|
CV8710 Series |
Underachievement |
||||||
|
CV8715 Series |
Underachievement |
||||||
|
CV3300@ Series |
Underachievement |
||||||
|
CV8760 Series |
Underachievement |
||||||
|
CV8210 Series |
Underachievement |
||||||
|
CV4100 Series |
Underachievement |
||||||
|
Shanghai (China) |
Under investigation |
||||||
|
Ayutthaya (Thailand) |
Under investigation |
||||||
|
Circuit board material |
Ayutthaya (Thailand) |
2003 to present |
2 |
R-8700(EF) |
Tracking resistance |
Underachievement |
1 |
|
R-8700(SB) |
- |
||||||
|
South Yokkaichi (Japan) |
2011 to 2021 |
1 |
R-1586(H) |
- |
- |
- |
|
(2) Instances of data alternation
(a) Some data for circuit board materials was altered for Relative Thermal Index (“RTI”) when applying for new product registration.
|
Product type |
Production Location |
Irregularity Time Period |
Part No. Count |
Part Number |
|---|---|---|---|---|
|
Circuit board material |
Koriyama (Japan) |
2011 to present |
8 |
R-1515E |
|
2013 to present |
R-15T1 |
|||
|
2019 to present |
R-5515 |
|||
|
2015 to present |
R-5785 |
|||
|
2021 to present |
R-5795 |
|||
|
No sales results |
R-9575Q |
|||
|
2012 to 2020 |
R-1533 |
|||
|
2015 to 2019 |
R-1533E |
|||
|
Guangzhou (China) |
2019 to present |
5 |
R-5375 |
|
|
2017 to present |
R-5575 |
|||
|
2019 to present |
R-5785 |
|||
|
2021 to present |
R-5795 |
|||
|
2016 to present |
R-A555 |
|||
|
Suzhou (China) |
2012 to present |
3 |
R-1515E |
|
|
2016 to present |
R-A555 |
|||
|
2013 to 2020 |
R-1533 |
|||
|
Taiwan |
2012 to present |
3 |
R-1515E |
|
|
2016 to present |
R-A555 |
|||
|
2011 to 2016 |
R-1533 |
(b) Some data for circuit board materials were altered regarding flammability ratings when applying for new product registration.
|
Product type |
Production Location |
Irregularity Time Period |
Part No. Count |
Part Number |
|---|---|---|---|---|
|
Circuit board material |
Koriyama (Japan) |
2017 to present |
1 |
R-1566S |
|
Guangzhou (China) |
2020 to present |
1 |
R-1566S |
|
|
Guangzhou (China) |
2016 to present |
1 |
R-A555 |
|
|
Suzhou (China) |
2016 to present |
1 |
R-A555 |
|
|
Taiwan |
2016 to present |
1 |
R-A555 |
(3) Irregularities in periodic audits
|
Product type |
Production Location |
Irregularity Time Period |
Part No. Count |
Part Number |
|---|---|---|---|---|
|
Molding material |
Yokkaichi (Japan) |
2014 to present |
1 |
CY861130GN |
|
Shanghai (China) |
Under investigation |
|||
|
Ayutthaya (Thailand) |
Under investigation |
|||
|
Circuit board material |
Ayutthaya (Thailand) |
Starting time under investigation - 2021 |
2 |
R-8700/R-8705 |
|
R-8500/R-8505 |
||||
|
About Panasonic Industry Co., Ltd. Panasonic Industry Co., Ltd. was established on April 1, 2022, as an operating company in charge of the device business within the Panasonic Group in line with its shift to an operating company system. The mission of the company states that "We will open the way to a better future and continue to contribute to an affluent society through a variety of device technologies." On a global basis, the company has about 42,000 employees and achieved net sales of 1,149.9 billion yen for the fiscal year ended March 31, 2023. Against the backdrop of a labor shortage in manufacturing, the explosion of data with the rise of the information-based society, and greater demands for the environment and safety for the mobility society, the company will focus on areas where ongoing evolution is required and continue to provide customer value with distinctive features of unique material and process technologies such as capacitors, compact servomotors, EV relays, and electronic materials. Learn more about Panasonic Industry at https://www.panasonic.com/global/industry. |
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