Irregularities in third-party certification of electronic materials and establishment of the external investigation committee

Osaka, Japan – Following an internal investigation, Panasonic Industry Co., Ltd. (“PID”) has identified instances of irregularities in the process of the third-party certification by UL Solutions (“UL”) for 52 part numbers of molding materials, semiconductor encapsulation materials and electronic circuit board laminate products manufactured and sold by PID’s Electronic Materials Business Division.  In response to these irregularities, PID is providing this notification of the current situation and its planned actions.

- Molding materials, Yokkaichi plant (from the 1980s to present): 17 part numbers*
* 11 of these part numbers did not meet a certain threshold for their flammability ratings

- Semiconductor encapsulation materials, South Yokkaichi plant (from the 1980s to present): 19 part numbers*
* 19 part numbers did not meet a certain threshold for their flammability ratings

- Circuit board materials, Ayutthaya plant (from 2003 to present): 2 part numbers.*
* 1 of these part numbers did not meet a certain threshold for tracking its resistance

- Circuit board material, South Yokkaichi plant (from 2011 to 2021): 1 part number

- Koriyama plant (2010 to present): 8 part numbers

- Guangzhou plant (2016 to present): 5 part numbers

- Suzhou plant (2012 to present): 3 part numbers

- Taiwan plant (2011 to present): 3 part numbers

- Koriyama plant (2014 to present): 1 part number

- Guangzhou plant (2016 to present): 2 part numbers

- Suzhou plant (2012 to present): 1 part number

- Taiwan plant (2011 to present): 1 part number

- Molding material, Yokkaichi plant (2014 to present): 1 part number

- Circuit board materials, Ayutthaya plant (until 2021): 2 part numbers

• Molding materials:
  JIS (Japan industrial standard) defines a molding material as "a material made mainly of polymeric substances that is formed into a usable shape." This generally refers to a plastic (resin) material molded into an intended shape. Molding materials are used in products such as automotive components and home appliances.
• Semiconductor encapsulation materials:
  Semiconductor encapsulation material is a polymer-based composite used to protect semiconductor chips from the environment.
• Circuit board materials:
  Circuit board material is a polymer composite sheet with or without copper foil on one or both sides. Circuit structures are formed on the copper and then the layers are laminated together with heat and pressure to form functional circuit boards.
• Flammability:
  Flammability is expressed in an assigned grade representing the degree of a plastic material's resistance to fire.
• Tracking resistance:
  Tracking refers to electrical breakdown on the surface of an electrical insulating material, as the result of low resistance paths (“tracks”), typically as a result of moisture or contamination. Tracking resistance is an indicator of a circuit board material's capability to resist tracking.
• Relative thermal index (RTI):
  The Relative Thermal Index (RTI) is a value related to the ability of circuit board materials to resist thermal degradation. RTI refers to the temperature at which the initial physical property value of a plastic reduces to half, after the plastic is exposed to air at a given temperature for 60,000 hours.