Panasonic Corporation today announced the following organizational changes, assignment of responsibilities to an executive officer and personnel changes effective October 1, 2018.
FY2018 Sep
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The L-Mount Alliance: a strategic cooperation between Leica Camera, Panasonic and Sigma
At the company's press conference prior to the opening of photokina 2018, Leica Camera AG, Panasonic and Sigma announced a strategic partnership.
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Panasonic Develops Two Models of Its First Full-Frame Mirrorless Camera
Panasonic Corporation has developed two models of its first Digital Single Lens Mirrorless camera with a 35 mm full-frame image sensor, the LUMIX S1R and the S1.
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Panasonic's Multi-hop HD-PLC Adopted as Smart Meter Communications System by Taiwan Power Company
Panasonic Corporation has successfully proposed adoption to Taiwan Power Company of its HD-PLC high-speed power line communications technology as a communications system to utilize next-generation smart meters.
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Panasonic Celebrates the 30th Anniversary of Its Rice Cooker Business in India
Panasonic Corporation announced today that its rice cooker business in India has marked the 30th anniversary this month.
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Panasonic Entered Partnership with Caspar to Develop Artificial Intelligence Smart Home System
Panasonic Corporation today announced that it has invested in Caspar (leading Artificial Intelligence (AI) smart home startup in USA) and started collaboration with Caspar to develop integrated AI smart home system.
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Panasonic Announces Receipt of Notice of Correction from Osaka Regional Tax Bureau and its Response
Panasonic Corporation today announced it has received a notice of correction of corporate income tax from Osaka Regional Tax Bureau. The company disagrees with the desicion and will immediately tale necessary procedures.
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Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
Panasonic's new underfill products increase the reliability of automotive electronic systems by reinforcing the solder connections between semiconductor packages and printed circuit boards to meet stringent industry requirements.