Panasonic's next-generation HD-PLC technology for IoT-related services was adopted as the IEEE 1901a standard. It allows scalable communications with speed or distance depending on IoT applications.
Devices
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Terahertz wireless makes big strides in paving the way to technological singularity
Hiroshima University, National Institute of Information and Communications Technology, and Panasonic Corporation announced the successful development of a terahertz (THz) transceiver that can transmit or receive digital data at 80 gigabits per second (Gbit/s).
Category: Devices Technology/R&D
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Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material (Halogen-free MEGTRON6) for Communications Infrastructure Equipment
Panasonic's new halogen-free multi-layer circuit board material enables greater-capacity and higher-speed transmission of data communication, which will contribute to the popularization of 5th-generation (5G) mobile communication systems.
Category: BtoB Solutions Devices
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Panasonic to Bolster Substrate Material Business for Semiconductor Packages and Modules in China and North East Asian Region
Panasonic Corporation announced today that it will enhance its production and development functions for the substrate material MEGTRON GX, which is used in semiconductor packages and modules, in China and the North East Asian region.
Category: BtoB Solutions Devices
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Panasonic to Commercialize Hydrogen Fuel Cell Generator
Panasonic Corporation announced today that it will accelerate initiatives to achieve a sustainable society by utilizing hydrogen energy through the application of its technologies developed for residential fuel cells.
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Panasonic's Multi-hop HD-PLC Adopted as Smart Meter Communications System by Taiwan Power Company
Panasonic Corporation has successfully proposed adoption to Taiwan Power Company of its HD-PLC high-speed power line communications technology as a communications system to utilize next-generation smart meters.
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Panasonic Commercializes Heat Resistant Underfill CV5794 Designed to Improve the Reliability of Automotive Electronics
Panasonic's new underfill products increase the reliability of automotive electronic systems by reinforcing the solder connections between semiconductor packages and printed circuit boards to meet stringent industry requirements.
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Panasonic Next-Generation PLC Technology Approved as Baseline Specification by IEEE P1901.3 Working Group
Panasonic Corporation announced today that it has presented its fourth-generation scalable HD-PLC technology to IEEE Standardization Working Group. The specifications using this technology as the technical baseline have been approved as an IEEE P1901.3 Working Document.
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Panasonic Develops Long-range TOF Image Sensor
Panasonic Corporation announced today that it has developed a time-of-flight (TOF) image sensor that uses avalanche photodiode (APD) pixels and is capable of capturing range imaging of objects up to 250 m even at night with poor visibility.
Category: Devices Technology/R&D
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Panasonic Develops Glass Composite Circuit Board Material that Improves Parts Mounting Reliability
Panasonic's new glass composite circuit board material improves the mounting reliability of electronic circuit board parts, thereby contributing to the long-term stable operation of automotive and industrial equipment.
Category: BtoB Solutions Devices
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Panasonic Develops an Ultra-low Transmission Loss Circuit Board Material for Semiconductor Packages and Modules
Panasonic's ultra-low transmission loss circuit board material for semiconductor packages and modules allows the stable operation of semiconductor devices that process enormous data at high speed.
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Panasonic Commercializes a High Vibration Acceleration-resistant, Power Choke Coil for Automotive Use
Panasonic's power choke coil for automotive use with the industry's highest resistance to vibration, contributes to more ECUs being placed within the engine itself and integration of mechanical and electronic in-vehicle components.
Category: BtoB Solutions Devices