Panasonic Corporation today announced that it has developed a thermal sensation estimation method using the infrared array sensor Grid-EYE.
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Panasonic Commercializes a High Dielectric Constant Encapsulation Molding Compound Suitable for Finger-Print Sensor Packages
Panasonic Corporation announced that it has commercialized an encapsulation molding compound that is suitable for finger-print sensor packages.
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Panasonic Commercializes the Industry's First Sulfur-free Encapsulation Molding Compound for Copper Wires
Panasonic Corporation announced that it has commercialized the first sulfur-free EMC for copper wire bonding in the industry.